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 Bulletin I27190 02/05
50MT060WHA 50MT060WHTA
"HALF-BRIDGE" IGBT MTP
Features
* Gen. 4 Warp Speed IGBT Technology * HEXFRED TM Antiparallel Diodes with UltraSoft Reverse Recovery * Very Low Conduction and Switching Losses * Optional SMD Thermistor (NTC) * Al2O3 DBC * Very Low Stray Inductance Design for High Speed Operation * UL E78996 approved
Warp Speed IGBT
VCES = 600V VCE(on) typ. = 2.3V @ VGE = 15V, IC = 50A TC = 25C
Benefits
* Optimized for Welding, UPS and SMPS Applications * Operating Frequencies > 20 kHz Hard Switching, >200 kHz Resonant Mode * Low EMI, requires Less Snubbing * Direct Mounting to Heatsink * PCB Solderable Terminals * Very Low Junction-to-Case Thermal Resistance
MMTP
Absolute Maximum Ratings Parameters
V CES IC I CM I LM I
F
Max
600 @ T C = 25C @ T C = 109C 114 50 350 350 @ T C = 109C 34 200 20 2500 658 263 @ T C = 25C @ T C = 100C
Units
V A
Collector-to-Emitter Voltage Continuos Collector Current Pulsed Collector Current Peak Switching Current Diode Continuous Forward Current Peak Diode Forward Current Gate-to-Emitter Voltage RMS Isolation Voltage, Any Terminal to Case, t = 1 min Maximum Power Dissipation
I FM V GE V ISOL PD
V W
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50MT060WHA, 50MT060WHTA
Bulletin I27190 02/05
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
Parameters
V(BR)CES Collector-to-Emitter Breakdown Voltage V CE(on) Collector-to-Emitter Voltage
Min Typ Max Units Test Conditions
600 2.3 2.5 1.72 3 3.15 3.2 2.17 6 0.4 10 1.58 1.80 1.49 1.68 1.9 2.17 250 V V GE = 0V, I C = 500A V GE = 15V, I C = 50A V GE = 15V, I C = 100A V GE = 15V, I C = 50A, TJ = 150C I C = 0.5mA V GE = 0V, V CE = 600V V GE = 0V, V CE = 600V, TJ = 150C I F = 50A, V GE = 0V I F = 50A, V GE = 0V, T J = 150C I F = 100A, V GE = 0V, T J = 25C V GE = 20V
V GE(th) I CES V FM
Gate Threshold Voltage Collector-to-Emiter Leaking Current Diode Forward Voltage Drop
mA V
I GES
Gate-to-Emitter Leakage Current
nA
Switching Characteristics @ TJ = 25C (unless otherwise specified)
Parameters
Qg Qge Qgc Eon Eoff Ets Eon Eoff Ets Cies Coes Cres trr Irr Qrr trr Irr Qrr Total Gate Charge (turn-on) Gate-Emitter Charge (turn-on) Gate-Collector Charge (turn-on) Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak Reverse Current Diode Recovery Charge Diode Reverse Recovery Time Diode Peak Reverse Current Diode Recovery Charge
Min Typ
331 44 133 0.26 1.2 1.46 0.73 1.66 2.39 7100 510 140 82 8.3 340 137 12.7 870
Max Units Test Conditions
385 52 176 nC IC = 52A V CC = 400V VGE = 15V Internal gate resistors (see Electrical Diagram)
IC = 50A, VCC = 480V, VGE = 15V, L = 200H Energy losses include tail and diode reverse recovery
mJ
mJ
Internal gate resistors (see Electrical diagram)
IC = 50A, VCC = 480V, VGE = 15V, L = 200H Energy losses include tail and diode reverse
pF
97 10.6 514 153 14.8 1132
ns A nC ns A nC
recovery, TJ = 150C VGE = 0V VCC = 30V f = 1.0 MHz VCC = 200V, IC = 50A di/dt = 200A/s
VCC = 200V, IC = 50A di/dt = 200A/s TJ = 125C
Thermistor Specifications (50MT060WHTA only)
Parameters
R0 (1)
(1) (1) (2)
Min Typ
30 4000
(2)
Max Units Test Conditions
k K T0 = 25C T 0 = 25C T1 = 85C
Resistance Sensitivity index of the thermistor material R0 R1
T0,T1 are thermistor's temperatures
= exp
[(1 T
1
0
T1
)]
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50MT060WHA, 50MT060WHTA
Bulletin I27190 02/05
Thermal- Mechanical Specifications
Parameters
TJ TSTG RthJC RthCS Operating Junction Temperature Range Storage Temperature Range Junction-to-Case Case-to-Sink Clearance Creepage T Wt
(3)
Min
IGBT, Diode Thermistor IGBT Diode Module - 40 - 40 - 40
Typ
Max
150 125 125 0.38 0.8
Units
C
C/ W
0.06 5.5 8 3 10% 66 Nm g mm
(Heatsink Compound Thermal Conductivity = 1 W/mK)
(external shortest distance in air (shortest distance along the external
(4)
between two terminals)
(3)
surface of the insulating material between 2 terminals)
Mounting torque to heatsink Weight
(3) Standard version only i.e. without optional thermistor (4) A mounting compound is recommended and the torque should be checked after 3 hours to allow for the spread of the compound. Lubricated threads
100
Maximum DC Collector Current (A) IC, Collector-to-Emitter Current (A)
120
Vge = 15V 20s Pulse Width
100 80 60 40 20 0 25
10
TJ = 150C
T J = 25C
1 0.1
1
VCE, Collector-to-Emitter Voltage (V) Fig. 1 - Typical Output Characteristics
10
50
75
100
125
150
TC, Case Temperature (C) Fig. 2 - Maximum Collector Current vs. Case Temperature
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50MT060WHA, 50MT060WHTA
Bulletin I27190 02/05
3
VCE , Collector-to-Emitter Voltage (V) VGE, Gate-to-Emitter Voltage (V)
20 16 12 8 4 0
Vcc = 400V Ic = 52A
2.5
I C = 100A I C = 50A
2
1.5
I C= 20A
1 20
40
60
80
100 120 140 160
0
100
200
300
400
TJ, Junction Temperature (C) Fig. 3 - Typical Collector-to-Emitter Voltage vs. Junction Temperature
QG, Total Gate Charge (nC) Fig. 4 - Typical Gate Charge vs. Gate-toEmitter Voltage
100
Instantaneous Forward Current - I F (A)
10
TJ = 150C TJ = 125C TJ = 25C
1 0.4
0.8
1.2
1.6
2
2.4
Forward Voltage Drop - VFM (V) Fig. 5 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
4
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50MT060WHA, 50MT060WHTA
Bulletin I27190 02/05
160
Vr = 200V
100
Vr = 200V
140
I F = 50A, Tj = 125C
I F = 50A, Tj = 125C
I RRM (A)
120
t rr (ns)
10
I F = 50A, Tj = 25C
100
I F = 50A, Tj = 25C
80
60 100
dif /dt - (A/s)
1000
1 100
di f /dt - (A/s)
1000
Fig. 6 - Typical Reverse Recovery vs. dif/dt
Fig. 7 - Typical Reverse Recovery Current vs. dif/dt
2000
Vr = 200V
1500
I F = 50A, Tj = 125C
Q RR (nC)
1000
500
I = 50A, Tj = 25C F
0 100
dif /dt - (A/s) Fig. 8 - Typical Stored Charge vs. di f/dt
1000
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50MT060WHA, 50MT060WHTA
Bulletin I27190 02/05
Outline Table
Functional Diagram
Electrical Diagram
Resistance in ohms Dimensions in millimetres Note: unused terminals are not assembled in the package
6
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50MT060WHA, 50MT060WHTA
Bulletin I27190 02/05
Ordering Information Table
Device Code
50
1
MT 060
2 3
W
4
H
5
T
6
A
7
1 2 3 4 5 6
-
Current Rating (50 = 50A) Essential Part Number Voltage rating (060 = 600V) Speed/ Type Special Option none = no special option T = Thermistor (W = Warp IGBT) = Half Bridge) Circuit Configuration (H
7
-
A = Al 2O3 DBC Substrate
Data and specifications subject to change without notice. This product has been designed and qualified for Industrial Level. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7309 Visit us at www.irf.com for sales contact information. 02/05
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